Broadcom, TSMC eye possible Intel deals to split storied chipmaker, WSJ reports


FILE PHOTO: A smartphone with a displayed Intel logo is placed on a computer motherboard in this illustration taken March 6, 2023. REUTERS/Dado Ruvic/Illustration/File Photo

(Reuters) -Intel's rivals Taiwan Semiconductor Manufacturing Co and Broadcom are each eyeing potential deals that would break the U.S. chipmaking icon in two, the Wall Street Journal reported on Saturday, citing people familiar with the matter.

Broadcom has been closely examining Intel's chip design and marketing business, the Journal reported, adding that the company had discussed a potential bid with its advisers but would likely only proceed if it found a partner for Intel's manufacturing business.

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