Malaysia and Netherlands sign deal to boost semiconductor industry ties


KUALA LUMPUR: Malaysia and the Netherlands have signed a cooperation agreement to strengthen ties in the semiconductor industry, aiming to reinforce Malaysia’s role as a global chip hub and the Netherlands’ position in advanced manufacturing and innovation.

The Memorandum of Cooperation (MoC) was signed in The Hague by Investment, Trade and Industry Minister Tengku Datuk Seri Zafrul Aziz and Dutch Economic Affairs Minister Vincent Karremans.

This agreement builds on an initiative first proposed by both countries’ prime ministers during the Dutch leader’s visit to Kuala Lumpur in 2023.

The agreement will establish an annual Malaysia–Netherlands Semiconductor Dialogue to review joint projects, share market and policy updates, and coordinate efforts in skills training, research and technology exchange.

“This partnership reflects our shared commitment to strengthening Malaysia’s assembly, testing and packaging capabilities, while also moving up the value chain by leveraging the Netherlands’ expertise in high-end chip manufacturing.

By combining our unique strengths, we are confident this collaboration will enhance global supply chain security and create new opportunities for innovation and growth in the global semiconductor industry.

Through the structured dialogue and joint initiatives, we aspire to build a resilient, future-proof semiconductor ecosystem that benefits both our nations and the global economy,” said Tengku Zafrul at the signing.

The cooperation comes as governments worldwide seek to diversify supply chains and remain competitive amid rapid technological change.

It also aligns with Malaysia’s National Semiconductor Strategy, which targets RM500bil in investments, the creation of homegrown companies, and the training of 60,000 engineers by 2030.

 

 

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