KUALA LUMPUR: Malaysia aims to attract RM500bil of investment in integrated circuit (IC) design, advanced packaging and manufacturing equipment for semiconductor chips, says Datuk Seri Anwar Ibrahim.
The Prime Minister said under Malaysia's National Semiconductor Strategy (NSS) launched in April, Putrajaya also aims to establish at least 10 Malaysian companies in design and advanced packaging with revenue between RM1bil and RM4.7bil.
