PETALING JAYA: The Global Electronics Association (formerly known as IPC) and Mimos Bhd have signed a memorandum of understanding or MoU to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem.
The strategic collaboration will focus on driving advanced electronic packaging, industry alignment, and global best practices, the parties said in a statement.
Mimos Technologies Sdn Bhd chief executive officer Afdzal Syahadat Husin said Malaysia’s electronics and semiconductor industry is entering a critical phase of transformation, driven by the growing complexity of next-generation technologies and the shift towards advanced electronic packaging.
“This collaboration reflects a shared commitment to strengthening Malaysia’s position within the global value chain by fostering deeper industry alignment, accelerating capability development, and advancing the adoption of globally recognised standards and best practices.
“Through this partnership, MIMOS aims to catalyse innovation, enhance ecosystem readiness, and support the nation’s ambitions to become a leading hub for high-value electronics manufacturing in the region,” he said.
Meanwhile, Global Electronics Association country manager for Malaysia Dr Ranee Ramya said strengthening industry alignment, advancing standards adoption, and enabling initiatives such as continuous quality improvement programmes and validation services are critical to positioning Malaysia as a leading hub for advanced electronics in South-East Asia.
The memorandum of understanding builds on Global Electronics Association’s growing presence in Malaysia, reflecting its commitment to supporting innovation and industry development in one of the region’s key electronics hubs.
