BSL Corp unit secures RM14.58m contract from SDU


KUALA LUMPUR: BSL Corporation Bhd’s unit Ban Seng Lee Industries Sdn Bhd has secured a US$3.5m (RM14.58mil) contract from SDU Pte Ltd to fabricate and supply semiconductor components, sub-assembly modules.

BSL Corp executive director Brian Hoo Wai Keong said the contract involved manufacturing and suppling a total US$3.5mil worth of integrated console, sheetmetal fabrication including precision machining.

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SDU Pte , BSL , precision machining

   

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