KUALA LUMPUR: BSL Corporation Bhd
’s unit Ban Seng Lee Industries Sdn Bhd has secured a US$3.5m (RM14.58mil) contract from SDU Pte Ltd to fabricate and supply semiconductor components, sub-assembly modules.
BSL Corp executive director Brian Hoo Wai Keong said the contract involved manufacturing and suppling a total US$3.5mil worth of integrated console, sheetmetal fabrication including precision machining.
Already a subscriber? Log in.
Limited time offer:
Just RM5 per month.
Cancel anytime. No ads. Auto-renewal. Unlimited access to the web and app. Personalised features. Members rewards.
Follow us on our official WhatsApp channel for breaking news alerts and key updates!
