BSL Corp unit secures RM14.58m contract from SDU


KUALA LUMPUR: BSL Corporation Bhd’s unit Ban Seng Lee Industries Sdn Bhd has secured a US$3.5m (RM14.58mil) contract from SDU Pte Ltd to fabricate and supply semiconductor components, sub-assembly modules.

BSL Corp executive director Brian Hoo Wai Keong said the contract involved manufacturing and suppling a total US$3.5mil worth of integrated console, sheetmetal fabrication including precision machining.

On Nov 10, BSLCorp had entered into share sale agreement to acquire SDU. This acquisition is pending completion.

The Singapore-based SDU operates an international procurement office centre, connecting the overseas supply chain for semiconductor original equipment manufacturers (OEM) approved vendor list components. This is complemented by SDU’s “One Stop Solution” concept for the manufacturing, sourcing and supplying of electro-mechanical products such as metal components, metal casing and metal fabrication for semiconductor producers which include semiconductor foundry equipment manufacturers.

Hoo said SDU is a qualified approved vendor of a few major semiconductor manufacturers in Singapore and its prospects are good due to the strong demand in the semiconductor sector which is experiencing a supply crunch.

The demand is across the board - arising from demand in basic microcontrollers and memory chips to the most sophisticated high-performance processors. Demand is across all sectors in particular the computing, wireless communications and automotive,” he said.

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SDU Pte , BSL , precision machining

   

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