Siemens automates design process for testing new chips with advanced packaging

FILE PHOTO: Visitors walk under a Siemens sign at the international consumer technology fair IFA in Berlin, Germany September 2, 2022. REUTERS/Lisi Niesner/File Photo

(Reuters) - Siemens Digital Industries Software, a unit of Siemens AG, on Monday said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced packaging.

While chips have traditionally been packaged with one silicon tile inside, as the industry faces challenges making features on these tiles smaller and smaller to cram more computing power into them, companies including Intel are starting to stack several of them, sometimes mixing and matching different technologies, to improve performance.