SkyeChip signs underwriting deal for Bursa Malaysia Main Market IPO


KUALA LUMPUR: SkyeChip Bhd has entered into a retail underwriting agreement with Maybank Investment Bank Bhd and CIMB Investment Bank Bhd in conjunction with its initial public offering (IPO) and listing on the Main Market of Bursa Malaysia Securities Bhd.

In a statement, the Penang-based company said the IPO involves a public issue of 400 million new shares, representing 22.3% of the enlarged share capital, with no offer for sale of existing shares.

Of the total, 264.67 million shares are allocated to cornerstone, institutional and selected investors, while 135.3 million shares are set aside for the Malaysian public, eligible directors, employees and contributors, including 99.4 million for pink form applicants and 35.9 million via public balloting.

SkyeChip commenced its integrated circuit (IC) design operations in 2020 and has since designed and developed a portfolio of proprietary silicon IPs, including memory interface intellectual properties (IPs), Network-on-Chip (NoC) IPs and die-to-die interface IPs, as well as custom ASICs for applications such as AI inference.

The company has filed over 100 patent applications in Malaysia, China and the United States.

The IPO proceeds will be utilised within three years, with about 60% allocated for research and development of IC products and silicon IP, including next-generation memory interface IPs and expansion into automotive IP.

About 16% will go towards computing infrastructure and facilities, 10% for electronic design automation tools, with the balance for working capital and listing expenses.

Non-independent executive director and chief executive officer, Datuk Fong Swee Kiang said the IPO will support the company’s growth in AI, high-performance computing and autonomous vehicle applications.

“The IPO proceeds will allow us to further advance our silicon IPs and custom ASIC development in applications such as AI, high-performance computing and autonomous vehniicles, as we work towards strengthening SkyeChip’s presence as a global IC design company.”

Maybank IB is the principal adviser, lead bookrunner and managing underwriter, while CIMB IB is joint bookrunner and joint underwriter.

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