Heitech to raise RM22.98mil via placement


PETALING JAYA: Heitech Padu Bhd is proposing a private placement of 10.12 million new ordinary shares to raise gross proceeds of RM22.98mil for working capital purposes.

In a filing with Bursa Malaysia, the company said the issuance of new ordinary shares represents 10% of the total number of issued shares of the company.

It said the placement shares will be placed to third-party investors to be identified later.

Follow us on our official WhatsApp channel for breaking news alerts and key updates!

Next In Business News

SkyGate acquires property investment firm for RM76mil
Berjaya Land proposes name change to Berjaya Property
SCIB shareholders approve rights issue, share capital reduction
SC Estate Builder to acquire 25% stake in non-operational hotel for RM18.79mil
FBM KLCI on a roll, notches fifth straight gain
China central bank to cut some sector-specific rates to boost economy
Ericsson plans to shed 1,600 jobs in Sweden
South Korea to keep monitoring US chip tariffs to minimise impact, industry minister says
Oil slides over 3% after Trump comments ease Iran fears
Amir Hamzah: 2026 marks implementation of govt reforms, development agenda

Others Also Read