JF Technology enters joint venture for high-end semiconductor materials in AI and EV Tech

JF Technology Bhd managing director Datuk Foong Wei Kuong (seated, right) and Shenzhen HFC Co Ltd president Norman Sun (seated, left).

KUALA LUMPUR: JF Technology Bhd’s wholly-owned subsidiary, JF International Sdn Bhd (JFI) has entered into a joint venture agreement (JVA) with HFC Industry HK Limited (HFCI), a subsidiary of Shenzhen HFC Co Ltd (Shenzhen HFC) to incorporate HFC Tech Sdn Bhd (HFC Tech).

In a statement, JF Technology said the joint-venture company’s principal activities include design and manufacture of electromagnetic interference (EMI) shielding materials, thermal interface materials, absorbing materials, etc.

JF Technology managing director Datuk Foong Wei Kuong said the creates strong synergies as it will be able to leverage on each other’s expertise, capabilities and network to further scale our business.

“Our new facility in Kota Damansara has ample space to facilitate the establishment a state-of-the-art manufacturing and design hub for our joint venture. Together, we will be producing various cutting-edge products such as EMI shielding materials and thermal interface materials, which are currently used in various applications, including semiconductor chips for AI and EV.

“Shenzhen HFC is a pioneer in the use of graphene materials for heat dissipation in Al chips. Thus, whoever controls the material science of graphene for this application, potentially controls the industry,” he said.

Under the JVA, HFCI will be investing RM3.2mil in HFC Tech for a 80%- ownership while JFI shall contribute RM800,000 for the balance 20% stake.

Therefore, the registered capital of HFC Tech will be RM4mil, which will be utilised for operational needs.

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