India’s infrastructure lender plans US$606mil bond

The infrastructure-focused lender plans to leverage the government’s equity capital to the extent of three or four trillion rupees (RM156bil to RM209bil)through issuance of tier-one and tier-two bonds. — Reuters

NEW DELHI: India’s newly created infrastructure-financing institution is planning a maiden bond issue of 50 billion rupees (US$606mil or RM2.61bil) in the next quarter, according to a senior official at the company.

The institution wants to test the market in terms of pricing with the small issuance, Rajkiran Rai, managing director at the National Bank for Financing Infrastructure and Development (NaBFID), India’s new development finance institution, said in an interview.