Exclusive-Samsung's HBM chips failing Nvidia tests due to heat and power consumption woes, sources say

FILE PHOTO: The logo of Samsung is seen on a building during the Mobile World Congress in Barcelona, Spain February 25, 2018. REUTERS/Yves Herman/File Photo

SEOUL/SINGAPORE (Reuters) -Samsung Electronics' latest high bandwidth memory (HBM) chips have yet to pass Nvidia's tests for use in the U.S. firm's AI processors due to heat and power consumption problems, three people briefed on the issues said.

The problems affect Samsung's HBM3 chips, which are the fourth-generation HBM standard currently most used in graphics processing units (GPUs) for artificial intelligence, as well as fifth-generation HBM3E chips that the South Korean tech giant and its rivals are bringing to market this year, they said.