The RM30bil (US$7.10bil) investment is expected to create over 4,000 Intel jobs and more than 5,000 construction jobs in the country, the Malaysian government said. — Reuters
KUALA LUMPUR: Intel Corp will invest more than US$7bil (RM29.61bil) to build a new chip-packaging and testing factory in Malaysia, chief executive Pat Gelsinger said on Dec 16, expanding production in the country following a global shortage of semiconductors.
The new advanced packaging facility in Malaysia is expected to begin production in 2024, he said.
Already a subscriber? Log in.
Subscribe to The Star Yearly Premium Plan for 30% off
Cancel anytime. Ad-free. Full access to Web and App.
Monthly Plan
RM 13.90/month
RM 9.73/month
Billed as RM 9.73 for the 1st month, RM 13.90 thereafter.
Best Value
Annual Plan
RM 12.39/month
RM 8.63/month
Billed as RM 103.60 for the 1st year, RM 148 thereafter.
