The RM30bil (US$7.10bil) investment is expected to create over 4,000 Intel jobs and more than 5,000 construction jobs in the country, the Malaysian government said. — Reuters
KUALA LUMPUR: Intel Corp will invest more than US$7bil (RM29.61bil) to build a new chip-packaging and testing factory in Malaysia, chief executive Pat Gelsinger said on Dec 16, expanding production in the country following a global shortage of semiconductors.
The new advanced packaging facility in Malaysia is expected to begin production in 2024, he said.
