Intel shows research for packing more computing power into chips beyond 2025


FILE PHOTO: The Intel logo is displayed on computer screens at SIGGRAPH 2017 in Los Angeles, California, U.S. July 31, 2017. REUTERS/Mike Blake/File Photo

(Reuters) - Research teams at Intel Corp on Saturday unveiled work that the company believes will help it keep speeding up and shrinking computing chips over the next ten years, with several technologies aimed at stacking parts of chips on top of each other.

Intel's Research Components Group introduced the work in papers at an international conference being held in San Francisco. The Silicon Valley company is working to regain a lead in making the smallest, fastest chips that it has lost in recent years to rivals like Taiwan Semiconductor Manufacturing Co and Samsung Electronics Co Ltd.

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