PETALING JAYA: Kelington Group Bhd
has secured its largest-ever project worth a provisional US$452mil, or about RM1.83bil, to provide turnkey total facility tool hookup services for a semiconductor wafer fabrication facility in Gujarat, India.
The integrated engineering solutions provider said its unit Kelington Engineering (S) Pte Ltd had accepted the letter of award, under which Kelington will serve as the main contractor for the project.
The scope covers the overall design, installation, connection, testing and handover of manufacturing, laboratory and support tools, together with related tool-specific support systems for Modules 1 and 2 of the facility.
The works are expected to take 30 months, with completion targeted for February 2029, it said.
The provisional contract comprises US$249.9mil for Module 1 and US$202mil for Module 2, covering up to 886 tools.
The final contract value will depend on the actual quantities of tools and services executed.
Chief executive officer Lim Seng Chuan said the award marked a significant milestone for Kelington as it expands its role in the semiconductor industry.
“It is not only the largest project we have ever secured since our establishment, but also a strong validation of our capabilities, technology and execution track record,” he said in a statement yesterday.
Lim said the contract elevates Kelington’s contracting and management capabilities as a main contractor for semiconductor turnkey total facility tool hookup services.
The latest contract follows an earlier award from the same client for a different scope of work.
