PETALING JAYA: Oppstar Bhd
has secured a US$2.9mil (RM13.7mil) design contract to develop a reconfigurable artificial intelligence (AI) chip solution, marking a step forward in its push into the fast-growing edge AI segment.
The group said its wholly owned subsidiary, Oppstar Microelectronics Sdn Bhd, has entered into a statement of work with a Yokohama-based technology firm and Silicon X Sdn Bhd to collaborate on the project. The initiative will combine Silicon X’s silicon-proven architecture with Oppstar’s advanced design methodologies to deliver an AI chip optimised for power and performance.
Under the agreement, Oppstar will undertake the full spectrum of chip design and physical implementation, including architecture optimisation and final tape-out, while Silicon X will provide the underlying intellectual property and software enablement.
The project is expected to be completed over 20 months, with payments tied to milestone achievements.
