Seoul: LG Innotek, South Korea’s leading camera module maker, has started the mass production of flip-chip ball-grid array (FC-BGA) substrates, the high-end chip substrates for servers and data centres, a highly lucrative but competitive field driven by advancements in artificial intelligence.
“We started production for a leading North American tech giant and are discussing (new deals) with other global clients,” chief executive officer Moon Hyuk-soo told reporters last Thursday on the sidelines of the Consumer Electronics Show exhibition in Las Vegas.
