Feytech signs underwriting agreement for listing on Main Market

From left: TA Securities head of corporate finance Dominic Seah, executive director of operations Tah Heong Beng, Feytech executive director Tan Sun Sun, executive director and CEO Connie Go, AmInvestment Bank CEO Tracy Chen Wee Keng and deputy CEO Christopher Ng Kok Wai.

KUALA LUMPUR: Feytech Holdings Bhd, en route to a listing on the Main Market of Bursa Malaysia, has signed an underwriting agreement with TA Securities Holdings Bhd and AmInvestment Bank Bhd for the company’s initial public offering (IPO).

In a statement, Feytech, which is principally an automotive cover and seat manufacturer, said the IPO entailed a public issue of 143.32 million new ordinary shares and an offer for sale of 109.62 existing shares.