HeiTech Padu proposes private placement to raise RM22.98mil for working capital


KUALA LUMPUR: Heitech Padu Bhd has proposed a private placement of 10.12 million new ordinary shares, raising gross proceeds of RM22.98 million, which will be utilised for working capital.

The issuance of new ordinary shares is representing 10 per cent of the total number of issued shares of the company and the placement shares will be placed to third-party investors to be identified later.

"These proceeds shall mainly be utilised for staff salaries, employers’ statutory contributions, payment to suppliers and creditor, office administrative expenses, utilities expenses and overhead expenses,” it said in a filing with Bursa Malaysia today.

In an earlier Bursa Malaysia filing, HeiTech Padu said it had bagged a contract from the Road Transport Department (JPJ) worth RM190.01 million on April 15.

The tender is for the maintenance and technical support services for the information and communications technology infrastructure and MySikap system in all JPJ offices.

The contract is for a period of 36 months commencing from May 1, 2024 to April 30, 2027. - Bernama

Follow us on our official WhatsApp channel for breaking news alerts and key updates!
   

Next In Business News

Wall St set to open lower on economic data; Fed verdict on tap
TM to further accelerate AI endeavours this year
Auditor flags going concern for Magna Prima
PTT Synergy buys land for RM36mil
GFIEF to help Malaysia regain positioning as top innovator in Islamic finance
Fernandes: Geopolitical risks will not affect Capital A's regional operations in 2024
Ringgit closes marginally lower against US dollar ahead of Fed meeting
GUH Holdings gets RM69.49mil contract from Gamuda
CIMB Niaga's pre-tax profit rises 7.8% to 2.2 trillion rupiah
F&N profit jumps 63.5% in 2Q on the back of higher revenue

Others Also Read