Bosch to spin off semiconductor division in January 2028


FILE PHOTO: The Bosch logo is reflected in a semiconductor wafer in the company manufacturing base in Reutlingen, Germany, June 16, 2017. REUTERS/Michaela Rehle/File Photo

Nov 3 (Reuters) - ⁠Bosch, the world's top ⁠automotive supplier, will spin off ‌its semiconductor division in January 2028, it said on Tuesday.

• The German ​firm said it aims ⁠to increase ⁠sales of the small components used ⁠in ‌cars and e-bikes to 5 billion euros ($5.59 ⁠billion) by 2030

• Currently, the semiconductor ​activities ‌are part of the Mobility ⁠Electronics ​division

• The firm will increasingly open its manufacturing capacities to ⁠external partners and strategically ​expand its foundry business, it added

• Bosch, which relies on a ⁠network of around 40 semiconductor sites worldwide for research, development, and manufacturing, plans to ​further expand its ⁠test centre in Penang, Malaysia, ​by the middle ‌of the 2030s

($1 = 0.8937 ​euros)

(Reporting by Paolo Laudani, Editing by Friederike Heine)

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