Broadcom CEO says biggest hurdle in AI-fuelled tech growth is capital, not memory chips


FILE PHOTO: The Broadcom logo in this illustration taken June 11, 2026. REUTERS/Dado Ruvic/Illustration/File Photo

SINGAPORE, Oct ⁠12 (Reuters) - Broadcom CEO ⁠Hock Tan said ‌on Monday that capital will be the biggest constraint ​facing the ⁠company as AI ⁠development continues.

• At a ⁠panel ‌in Singapore on Monday, ⁠Tan said that the company ​is ‌overcoming wafer shortages ⁠and memory ​shortages, but capital will be the ⁠biggest constraint

• He ​added that frontier labs Anthropic andOpenAI have shown ⁠that they can generate significant revenue from the latest models ​that ⁠have been deployed for ​AI personal ‌assistants

(Reporting by Jun ​Yuan Yong; Editing by David Stanway)

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