SK Hynix plans to double wafer capacity in next five years, group chairman says


FILE PHOTO: The SK Hynix logo appears in this illustration taken August 25, 2025. REUTERS/Dado Ruvic/Illustration/File Photo

TAIPEI, June 2 (Reuters) - The ⁠chairman of South Korea's SK Group said on ⁠Tuesday its memory chip unit SK Hynix aims to ‌double wafer capacity over the next five years.

Chey Tae-won was speaking at the Computex conference in Taipei, where executives from some of the ​world's top technology companies, including Nvidia, are ⁠gathering.

Chey, who warned in ⁠March that a global chip wafer shortage was likely to ⁠persist ‌until 2030, also said the company needs more partnerships in Taiwan, not just with TSMC, the ⁠world's largest contract chipmaker.

He added that he hopes ​his company can ‌be a major high-bandwidth memory (HBM) supplier for Nvidia's ⁠Vera Rubin system.

Last ​week, SK Hynix topped $1 trillion in market value for the first time, joining rivals Samsung Electronics and Micron Technology in reaching ⁠the milestone on an AI-driven rally.

SK Hynix, ​Nvidia's leading supplier of HBM chips, held a 58% share in the global HBM market in the first quarter, followed ⁠by Samsung and Micron, each with a 21% share, according to Counterpoint Research.

Chey's comments come as some analysts say the AI boom is reshaping the traditionally cyclical memory industry.

Goldman ​Sachs raised its 2028 operating profit ⁠forecasts for SK Hynix and Samsung Electronics by 24% and 23.3%, ​respectively, to 454 trillion won ($299.62 ‌billion) and 610 trillion won, citing ​sustained AI-driven demand.

(Reporting By Wen-Yee Lee and Heekyong Yang; Editing by Anne Marie Roantree and Muralikumar Anantharaman)

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