Exclusive-Broadcom expects to sell 1 million 3D stacked chips by 2027


FILE PHOTO: A Broadcom logo and a computer motherboard appear in this illustration taken August 25, 2025. REUTERS/Dado Ruvic/Illustration/File Photo

SAN JOSE, California, Feb ⁠26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by ⁠2027 based on its stacked design tech, an executive told Reuters on Wednesday.

The forecast, which Reuters is ‌the first to report, marks a new product and sales target for Broadcom that could represent a revenue stream potentially worth billions of dollars.

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