Samsung Electronics says it has shipped HBM4 chips to customers

Samsung Electronics HBM4, a sixth-generation high-bandwidth memory solution for AI and HPC applications, on display during the 2025 Korea Tech Festival in Seoul, South Korea, December 4, 2025. REUTERS/Kim Hong-Ji

SEOUL, ⁠Feb 12 (Reuters) - Samsung ⁠Electronics said ‌on Thursday that it has begun shipping ​its latest ⁠high-bandwidth memory ⁠chips, known as ⁠HBM4, to ‌customers as ⁠the South Korean chipmaker ​seeks ‌to catch up ⁠with ​rivals in the race ⁠to supply the ​semiconductor crucial for Nvidia's AI chipsets.

Samsung ⁠Electronics said it is first company to ​mass-produce ⁠and ship the ​HBM4 ‌chips.

(Reporting by Hyunjoo ​JinEditing by Ed Davies)