FILE PHOTO: Semiconductor chips are seen on a printed circuit board in this illustration picture taken February 17, 2023. REUTERS/Florence Lo/Illustration/File Photo
AMSTERDAM (Reuters) -BE Semiconductor Industries (Besi) raised its long-term financial targets on Thursday ahead of its investor day, saying the future is bright for its advanced chip stacking tools.
The Dutch firm makes the world's most accurate hybrid bonding tool, a critical chip technology allowing multiple chips to be bonded directly on top of each other.
