Chinese method of making ultra-thin semiconductors could lead to faster microchips

Research addresses key barrier to reducing the size of traditional silicon-based chips. — SCMP

Chinese scientists have produced an ultra-thin semiconductor material in a development that could lead to the creation of faster and more energy-efficient microchips.

A team led by Liu Kaihui of Peking University, Liu Can of Renmin University, and Zhang Guangyu of the Institute of Physics at the Chinese Academy of Sciences developed a fabrication method to produce a semiconductor material just 0.7 nanometres thick.