PETALING JAYA: Malaysian Pacific Industries
Bhd (MPI) is ramping up development expenditure with fresh commitments to wide-bandgap technologies, next-generation power modules, and robotics sensors, as management reaffirms its long-term strategy to stay ahead of structural shifts in semiconductor demand.
CIMB Research expressed optimism about MPI’s prospects for its financial year ending June 30, 2026 (FY26), supported by a healthy pipeline of power module packages for both general-purpose and artificial intelligence (AI) data centre servers, a gradual recovery in the automotive segment, and diversification into the emerging robotics market.
