DPM Gan Kim Yong (right) launching the initiative with Dr Prabu Raja, president of the semiconductor products group at Applied Materials. — The Straits Times
SINGAPORE: Applied Materials Inc, the largest US maker of chip-manufacturing equipment, has launched an initiative to bring together firms from across the semiconductor industry in Singapore to accelerate technologies for energy-efficient computing.
The initiative – named Equipment and Process Innovation and Commercialisation (Epic) Advanced Packaging Platform – will encourage alliances between equipment makers, material providers, device companies and research institutes.
