Feytech inks underwriting deal with TA Securities, AmInvestment Bank

From left: TA Securities head of corporate finance Dominic Seah, executive director of operations Tah Heong Beng, Feytech executive director Tan Sun Sun, executive director and CEO Connie Go, AmInvestment Bank CEO Tracy Chen Wee Keng and deputy CEO Christopher Ng Kok Wai

KUALA LUMPUR: Feytech Holdings Bhd has entered into an underwriting agreement with TA Securities Holdings Bhd and AmInvestment Bank Bhd for the company's initial pulic offering (IPO) on the Main Market of Bursa Malaysia.

In a statement, the automotive cover and seat manufacturer said its IPO entails a public issue of 143.32 million new shares and an offer for sale of 109.62 million existing shares.