TSMC considering advanced chip packaging capacity in Japan, sources say


TOKYO: Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.

The deliberations are at an early stage, they added, declining to be identified as the information was not public.

Follow us on our official WhatsApp channel for breaking news alerts and key updates!
TSMC , semiconductor , technology

Next In Business News

Sunway’s surprise bid puts IJM in play
Luxury real estate trends in 2026
Jakarta set to rise
China’s gold rush continues
Enhance local content terms
Singapore roars into the new year
SC Estate Builder’s hotel acquisition under scrutiny
Department stores bet on experiences
FROM BANGSAR TO BEYOND
Asia to lead next AI wave

Others Also Read