SFP Tech inks underwriting agreement with Public Investment Bank

Keoh Beng Huat, founder and managing director of SFP Tech (left); and Lee Yo-Hunn, CEO Public Investment Bank

KUALA LUMPUR: ACE Market-bound SFP Tech Holdings Bhd has inked an underwriting agreement with Public Investment Bank Bhd for its initial public offering (IPO).

The integrated engineering and automation solutions provider said Public Investment Bank will underwrite 64 million new shares made available to the Malaysian public, the group's eligible employees and other persons who have contributed to the success of the group.