Wolfspeed secures $1.5 billion conditional loan commitment from US defense department


U.S. power chip maker Wolfspeed’s silicon carbide 200mm wafer is seen on display at Wolfspeed’s Mohawk Valley Fab in Marcy, New York, U.S., April 2022. Courtesy of Wolfspeed/Handout via REUTERS/File Photo

Oct 7 (Reuters) - Chipmaker ⁠Wolfspeed said on Wednesday it has ⁠received a conditional loan commitment for up ‌to $1.5 billion from the USDepartment of Defense to expand domestic production of silicon carbide materials and power devices, ​sending its shares surging 27% ⁠in extended trading.

• ⁠Wolfspeed makes chips using silicon carbide, which are ⁠more ‌energy-efficient and used in applications that require huge amounts of power conversion ⁠such as electric vehicles, solar inverters and ​industrial ‌power systems

• The company said the conditional ⁠30-year commitment, ​through the defense department's Office of Strategic Capital, reflects its efforts to optimize its capital ⁠structure and improve its financial foundation

• ​It plans to use the financing to upgrade its gallium nitride technology for next-generation communications ⁠infrastructure and electronic warfare systems and develop radiation-hardening capabilities

• The funding is subject to due diligence, definitive agreements, government approvals and other ​conditions

• Under the proposed terms, ⁠Wolfspeed would be required to issue to ​the department warrants to purchase ‌up to 7.5% of ​Wolfspeed's fully diluted equity

(Reporting by Dharna Bafna in Bengaluru; Editing by Shilpi Majumdar)

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