Exclusive-TSMC considering advanced chip packaging capacity in Japan, sources say

Taiwan Semiconductor Manufacturing Company's (TSMC) logo is seen while people attend the opening of the TSMC global R&D center in Hsinchu, Taiwan July 28, 2023. REUTERS/Ann Wang

TOKYO (Reuters) -Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.

The deliberations are at an early stage, they added, declining to be identified as the information was not public.