GEORGE TOWN: The Malaysia Semiconductor Industry Association (MSIA) announced the upcoming Asia Pacific Semiconductor Summit and Expo (APSSE) 2024, which will take place from Oct 16 to 18 at the Setia SPICE Convention Centre, Penang.
This three-day event will bring together industry leaders, innovators and experts from across the globe to explore the latest advancements in semiconductor technology and shape the future of the sector.
Featuring over 40 high-profile speakers, APSSE 2024 is set to become a pivotal event in Penang, addressing key topics in the semiconductor industry.
Speakers from top global companies such as IBM, NXP, Huawei, Western Digital, CIMB, Baidu and TF-AMD will share their expertise and insights on the latest trends, challenges and opportunities in the semiconductor ecosystem.
Key topics for discussion
> Global semiconductor growth and outlook: Keynote presentations from experts at ACM Research Inc. and panel discussions with leaders from IBM, Frost & Sullivan, and DF Automation and Robotics, among others, will provide a comprehensive overview of the current global semiconductor landscape.
> Transitioning from local to international investments: Speakers from UNISEM, NSW Automation and Invest Penang will explore strategies to expand semiconductor businesses internationally, navigating complexities and seizing global opportunities.
> Artificial Intelligence (AI): Presentations by senior executives from Huawei and IBM APAC will delve into how AI is revolutionising the semiconductor industry and reshaping global industries.
> Asia Pacific semiconductor strategies: Panellists from Western Digital, Singapore Semiconductor Industry Association (SSIA) and QDOS Holding Bhd will discuss the critical role of the Asia Pacific region in leading semiconductor innovation.
> Sustainability and ESG innovations: Representatives from DBS Bank, Solarvest Holdings Bhd and IBM will showcase how the semiconductor industry is aligning with ESG (Environmental, Social, and Governance) standards to drive sustainable innovation.
> Intellectual Property (IP): Experts from JF Technology Bhd, Rahmat Lim & Partners and Chung Chambers will explore how companies can leverage intellectual property to drive technological advancements and maintain sustainability.
> Advanced packaging and STEM talent development: Leading voices from NXP Malaysia, TechSearch International Inc. and YOLE Group will present on the next frontier in semiconductor packaging, while experts will discuss strategies to nurture the next generation of STEM talent
Event highlights
> Exhibition hall: With over 40 booths, companies will showcase the latest in semiconductor technology. Walk-in registrations are available for those who want to explore the exhibition, which is free with a visitor pass.
> Summit and forum: Engage with some of the most influential thought leaders from top global companies, gaining exclusive insights into the future of the semiconductor industry.
> Business matching: Take part in customised business matching sessions to connect with potential partners and investors.
> Gala dinner: Network with industry peers and leaders in a relaxed setting during our exclusive gala dinner.
Be part of APSSE 2024 and engage with the brightest minds in the semiconductor industry.
