KUALA LUMPUR: Unisem (M) Bhd
has proposed to undertake the second phase of expansion of its semiconductor production facility in Gopeng, Perak.
In a filing with Bursa Malaysia, the group said the expansion includes the construction of a production facility with an aggregate built-up of 40,000sqm complete with infrastructure and utilities, for an estimated cost of RM196mil.
Following its completion, the group will lease 50% of the production facility to its wholly-owned subsidiary Unisem Advanced Technologies Sdn Bhd (UAT) to expand its wafer bumping operations.
The cost of the associated facilitisation, estimated to cost RM200mil, will be fully borne by UAT, bringing the cost of the proposed construction to about RM396mil.
The group said the expansion is to meet growing demand for its wafer bumping and post-bump services.
"This expansion is part of the Group's strategic initiative to capture growing demand for advanced packaging, particularly in Artificial Intelligence (AI), data centres, and high-performance computing applications, and to position the Group for long-term growth," it said.
