KUALA LUMPUR: SkyeChip Bhd has joined the Rapidus Collaborative Open Rapid Ecosystem (Rapidus CORE) as a Design Solution Associate, giving the Malaysian integrated circuit (IC) design company a role in the Japanese chipmaker's advanced semiconductor ecosystem.
In a statement, the Main Market-listed company said it would contribute its silicon intellectual property (IP) for artificial intelligence (AI) and high-performance computing (HPC), as well as its IC design expertise.
The collaboration will support customers developing next-generation AI and HPC chips using Rapidus Corp's process technologies.
Rapidus, established in Japan in 2022, is developing advanced semiconductor manufacturing capabilities and is targeting the production of 2-nanometre chips by 2027.
Rapidus CORE, meanwhile, is an ecosystem comprising companies involved in areas such as semiconductor design and related technologies to support the development and mass production of advanced chips.
SkyeChip chief executive officer Datuk Fong Swee Kiang said joining the ecosystem would allow the company to work with Rapidus in supporting customers developing AI and HPC chips.
“Being appointed to Rapidus CORE recognises the depth of SkyeChip's silicon IP for AI and HPC, and our engineering capability in leading-edge chip design.
“We look forward to working with Rapidus to help customers bring advanced AI and HPC silicon to market faster,” he said.
“This is an important milestone in SkyeChip's journey to become a global silicon IP and silicon products company from Malaysia.”
