KUALA LUMPUR: AmBank Group and Huawei Technologies (Malaysia) Sdn Bhd (Huawei Malaysia) have signed a RM350 million supply chain financing deal to advance Malaysia’s digital infrastructure.
In a joint statement today, AmBank Group said the financing underscores its commitment to supporting the nation’s long-term digital and economic aspirations.
"Through this collaboration, AmBank Group aims to support the rollout of Malaysia’s second 5G network and strengthen the country’s digital infrastructure.
"The group will facilitate foreign direct investment by delivering customised financial solutions that meet the needs of multinational corporations operating in Malaysia and drive national digital transformation in alignment with Malaysia’s vision for a future-ready, technology-driven economy,” the statement said.
AmBank Group said the banking relationship highlights the bank’s role as a trusted financial partner to global technology leaders and reaffirms the bank’s dedication to enabling strategic foreign direct investment (FDI) that contributes to Malaysia’s economic growth.
AmBank Group managing director of business banking Christopher Yap said the agreement underscores their long-standing banking relationship with Huawei Malaysia and their shared vision of driving Malaysia’s digital transformation.
"This RM350 million supply chain financing facility demonstrates the progressive growth of our partnership with Huawei Malaysia and our confidence in supporting Malaysia’s digital ambitions at scale.
"By deepening this collaboration, we aim to attract high-value foreign investments and accelerate the development of a resilient, future-ready digital ecosystem for the nation,” he added. - Bernama
