AmBank, Huawei Malaysia sign RM350mil supply chain financing deal

From left: AmBank (M) Bhd U Chen Hock, AmBank group CEO Jamie Ling, Huawei Malaysia CEO Simon Sun and Huawei regional director of financing solutions Maggie Yuan at the signing ceremony in Shenzen, China.

KUALA LUMPUR: AmBank Group and Huawei Technologies (Malaysia) Sdn Bhd (Huawei Malaysia) have signed a RM350 million supply chain financing deal to advance Malaysia’s digital infrastructure.

In a joint statement today, AmBank Group said the financing underscores its commitment to supporting the nation’s long-term digital and economic aspirations.