KUALA LUMPUR: AppAsia Bhd has entered into a memorandum of understanding (MoU) with CMSC Inc to explore the setting up of a joint special purpose venture entity to provide integrated circuit design in Malaysia.
In a filing with Bursa Malaysia, the group said the collaboration will include the provision of integrated circuit front-end design, back-end design and turnkey solutions.
Taiwan-based CMSC is principally involved in the provision of IC design services and solutions.
According to AppAsia, the venture is part of its strategic expansion into the semiconductor industry, particularly integrated circuit design, with the aim of diversifying its business activities.
It would create an additional income stream for the company, it said.
