Wentel Engineering inks underwriting agreement with TA Securities

From left: Wentel Engineering non-independent and non-executive chairman Ban Kim Wah, executive director Wong Chun Wei, TA Securities executive director of operations Tah Heong Beng and head of corporate finance Ku Mun Fong

KUALA LUMPUR: Wentel Engineering Holdings Bhd has signed an underwriting agreement with TA Securities Holdings Bhd for the company's initial public offering (IPO) on the ACE Market of Bursa Malaysia.

In a statement, Wentel said its IPO entailed a public issue of 273.2 million new shares and an offer for sale of 46 million existing shares.