Audit: SilTerra advised to reduce wafer scrap rate, operating expenses

The SilTerra Malaysia plant in Kulim Hi-Tech Park in Kedah.

KUALA LUMPUR; SilTerra Malaysia Sdn Bhd is advised to reduce the rate of wafer scrap and take proactive action to cut operating expenses and the production of loss-making products to increase the company’s profits.

According to the Auditor General’s Report 2019 Series 2 released today, semiconductor wafer productions involved high operating expenses, causing SilTerra to incur losses.