Globetronics embarks on industry 4.0 transformation programme for business sustainability


KUALA LUMPUR: Globetronics Techology Bhd, a leading local miniaturised optical sensors manufacturer, has embarked on the adoption of Industry 4.0 Transformation Programme for business sustainability worth RM50.2 million.

The expansion will incorporate artificial intelligence (AI), big data analytics and extended reality (ER) which enables higher levels of customisation, reduction of cycle times and superior quality traceability for a diversified product portfolio and dynamic customer needs.

"Globetronics’ IR4.0 transformation focuses on workforce transformation, reimagining manufacturing and workforce training via ER which would bridge the gap between the digital and physical world,” it said in a joint statement with the Malaysian Investment Development Authority (MIDA), today,

It said the move towards integrating intelligence into the company’s machines and business processes was timely in addressing the non-skilled labour acquisition challenges and increasing the resilience in response to the COVID-19 pandemic.

It also said implementation of automation to its processes would help Globetronics focus on high revenue generation activities such as predictive and prescriptive data to maximise machine operations.

MIDA chief executive officer Arham Abdul Rahman said Globetronics’ expansion would pave way for enhancement in productivity, job creation and deepening the Malaysians skill set by leveraging cutting-edge technology and emerging AI capabilities.

He said this was in line with the government’s aspiration to spearhead rapid digital transformation in the manufacturing sector.

"While digitalisation is the antidote for business survival and growth in innovation-led value creation, Globetronics’ Industry 4.0 adoption will complement the electrical and electronics industry by producing advanced semiconductor photonic products,” he said.

He added that the expansion would demonstrate its commitment to continually invest in emerging technologies that were critical to support the constantly evolving landscape to ensure business sustainability.

The new platform is set to gear up for exciting next generation semiconductor wafer-level packaging technology, including the 2.5D, where stacking of dies would be replaced by flip-chip on a silicon interposer. - Bernama

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