KUALA LUMPUR (Bernama): Micron is strengthening its manufacturing footprint in Singapore through two previously announced investments to deepen its advanced manufacturing capabilities and support growing demand for artificial intelligence (AI).
"These investments reflect our long-term commitment in Singapore to advancing memory and storage technologies that will power the AI future,” said Micron corporate vice president and Singapore country manager Joshua Lee to a Singapore media.
"With the strong support of the Singapore government and our ecosystem partners, Micron continues to make meaningful progress in strengthening our manufacturing footprint and capabilities here.
"As we move forward with our High-Bandwidth Memory (HBM) advanced packaging and next-generation NAND manufacturing capabilities, we remain focused on driving innovation, strengthening Singapore’s semiconductor ecosystem and enabling the next generation of AI,” he said.
Construction of Micron's HBM advanced packaging facility, announced in January 2025, is progressing, with initial output expected in early 2027.
The facility, Micron's first HBM advanced packaging plant outside Taiwan, represents an investment of approximately US$7 billion through the end of the decade and beyond.
It will expand the company's advanced packaging capabilities to meet growing demand for HBM, a critical technology powering AI applications.
Micron is also proceeding with the next phase of its expansion in Singapore.
Following the groundbreaking ceremony in January 2026, the new advanced wafer fabrication facility is expected to begin operations in the second half of 2028.
With a planned investment of approximately US$24 billion over 10 years, the facility will become Singapore’s first double-story wafer fab.
Together, these projects represent important milestones in the continued development of Micron’s Singapore operations, building on the country’s established role as a key hub in Micron’s global manufacturing network.
-- BERNAMA
