FILE PHOTO: The logo of SoftBank is displayed at a company shop in Tokyo, Japan January 28, 2025. REUTERS/Issei Kato/File Photo
TOKYO (Reuters) - Japanese technology investment group SoftBank Group plans to raise 600 billion yen ($4.10 billion) by issuing bonds to retail investors, it said in a filing on Monday.
It is SoftBank's largest ever bond issuance and the proceeds will be used to redeem existing bonds and to cover a portion of the outstanding payment on the acquisition of shares of chip designer Arm from its Vision Fund investment vehicle in August 2023, a SoftBank spokesperson said.
