Japan's Kishida sees opportunities for more chip collaboration with US

Japan's Prime Minister Fumio Kishida speaks at a group interview ahead of a planned summit next week with U.S. President Joe Biden, in Tokyo, Japan April 5, 2024. REUTERS/Kim Kyung-Hoon/FILE PHOTO

WASHINGTON (Reuters) - Japanese Prime Minister Fumio Kishida said on Tuesday he sees opportunities for more collaboration between Japan and the United States in next-generation computer chips.

Kishida made the remark at a business roundtable on Critical and Emerging Technologies hosted the U.S. Chamber of Commerce in Washington the day before the Japanese leader is to hold a summit with U.S. President Joe Biden.