FILE PHOTO: Semiconductor chips are seen on a circuit board of a computer in this illustration picture taken February 25, 2022. REUTERS/Florence Lo/Illustration/File Photo
TOKYO (Reuters) - Japanese chip materials maker Resonac said on Wednesday it will set up a research and development centre for advanced semiconductor packaging and materials in Silicon Valley.
The packaging stage of production is increasingly being seen as critical for driving advances in chip technology, with the U.S. this week kicking off a $3 billion programme to boost its packaging capabilities.
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