Chinese molecular ‘glue’ could pave the way to advanced 3D-printed semiconductors

‘3D Pin’ technique helps researchers form stable bonds between suspended nanocrystals to create robust 3D structures. New materials in the 3D-printing toolbox could mean more cost-effective 3D semiconductors without compromising purity or performance. — SCMP

Three-dimensional (3D) printing has emerged in recent years from a boutique-style manufacturing alternative to become a mainstream conventional manufacturing process in an increasing number of applications across various industries.

The success of a 3D printed project depends largely on the quality of the bonds between the layers or particles in the material, which ultimately affects the properties of the structure.