TAINAN (Taiwan): UMC, the world’s No 2 contract chipmaker, said it will invest US$8bil (RM24bil) in a 12in wafer plant in Taiwan, joining its peers in investing in high-end technology to meet demand for chips in fast-growing markets like mobile devices.
UMC held a ground-breaking ceremony for phase 5 and 6 production plants at its 12in wafer fab in Tainan, southern Taiwan, on Thursday, with a schedule to install machines at the plant in the second half of next year. The company said it also plans to build phases 7 and 8.