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Techbond inks IPO underwriting agreement with Public Investment Bank

KUALA LUMPUR: Techbond Group Bhd has inked an underwriting agreement (UA) with Public Investment Bank Bhd (PIVB) for its initial public offering (IPO) exercise en route to its listing on the Main Market of Bursa Malaysia Securities Bhd (Bursa Securities) by year-end.

Techbond Group Bhd managing diretcor Lee Seng Thye (left) and Public Investment Bank Bhd deputy chief executive officer and head of corporate finance and advisory Lee Yo-Hunn (right).

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