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Weak start for Bursa Malaysia, technical outlook still bearish

KUALA LUMPUR: Bursa Malaysia extended its losses early Thursday after the weak corporate results, uncertainties in the US-China trade conflict issue while analysts are downbeat on the outlook for the FBM KLCI.

Techbond makes strong debut

KUALA LUMPUR: Techbond Group Bhd, which manufactures industrial adhesives made its trading debut on the Main Market amid a weak overall market, finishing the day up 20 sen to 86 sen.

Of the RM39.67mil in proceeds, it planned to use RM10mil to build a factory, RM17.24mil to purchase machinery and equipment and RM7.43mil as working capital.

KLCI closes off day's low, Tenaga extends fall

KUALA LUMPUR: Key Asian markets including Bursa Malaysia ended Wednesday in the red as investors worried about the outlook for the economy amid the US-China trade conflict.

KLCI brought lower by global recession fears, oil prices skid 2%


KUALA LUMPUR: Bursa Malaysia fell in Wednesday morning trade on the heels of Wall Street's sharp retreat overnight as the relief over the trade truce gave way to a flattening US Treasury yield curve, sparking recession fears.

Techbond in focus on trading debut on Main Market

KUALA LUMPUR: Techbond Group Bhd, which manufactures industrial adhesives, was in the spotlight on Wednesday as it made its trading debut on the Main Market amidst the gloomy Bursa Malaysia.

Techbond makes sterling IPO debut, shares up 27%

KUALA LUMPUR: Techbond Group Bhd made a strong share market debut today, with its shares up 27% at one point in early morning trade.

Asian stocks, KLCI hurt by overnight Wall St tumble

KUALA LUMPUR: Bursa Malaysia followed key Asian markets lower early Wednesday as investor sentiment was hit by the overnight decline on Wall Street amid uncertainties about the US-China trade war truce.

Techbond to raise RM39.6mil from IPO

KUALA LUMPUR: Techbond Group Bhd plans to raise RM39.67mil from the issuance of new shares ahead of its listing on the Main Market of Bursa Malaysia.

From left: Techbond Group Bhd managing director Lee Seng Thye exchanging documents with Public Investment Bank Bhd Deputy CEO and Head of Corporate Finance and Advisory Lee Yo-Hunn after the signing of underwriting agreement for Techbond’s intial public offering exercise. File picture taken on Sept  12 2018.

Techbond Group to raise RM39.6m from IPO

KUALA LUMPUR: Techbond Group Bhd plans to raise RM39.67mil from the issuance of new shares ahead of its listing on the Main Market of Bursa Malaysia.

Techbond's core activities are developing and manufacturing industrial adhesives and sealants.

Techbond inks IPO underwriting agreement with Public Investment Bank

KUALA LUMPUR: Techbond Group Bhd has inked an underwriting agreement (UA) with Public Investment Bank Bhd (PIVB) for its initial public offering (IPO) exercise en route to its listing on the Main Market of Bursa Malaysia Securities Bhd (Bursa Securities) by year-end.

Techbond Group Bhd managing diretcor Lee Seng Thye (left) and Public Investment Bank Bhd deputy chief executive officer and head of corporate finance and advisory Lee Yo-Hunn (right).