NexG gets Home Ministry contract extension for passport chip supply


PETALING JAYA: NexG Bhd has secured a six-month contract extension from the Ministry of Home Affairs (KDN) to continue supplying passport chips to the Immigration Department.

In a filing with Bursa Malaysia, the group said its wholly-owned subsidiary, Datasonic Technologies Sdn Bhd (DTSB) accepted the letter of extension dated July 2, 2025 for a period of six months from Dec 1, 2025 until May 31, 2026.

The first contract was received in December 2015 with an initial value of RM318.75mil over five years, from 2016 to 2021, for a total of 12.5 million chips.

The group said there was no change to the contract’s ceiling value, quantity or item value.

Risks include the state of the overall economy, pandemic crisis, changes in government regulations and operational risks.

“The contract is expected to contribute positively towards the future earnings and net assets per share of DTSB for the financial year ending March 31, 2026 and the financial year thereafter for the duration of the contract.”

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