KUALA LUMPUR: AppAsia Bhd is diversifying into the semiconductor business by inking a memorandum of understanding (MoU) with CMSC Inc, a Taiwanese integrated circuit (IC) design services provider.
Under the MoU, AppAsia planned to establish a special purpose venture entity to explore business opportunities in IC production, including IC design covering, IC front-end and back-end design and turnkey solutions, the company said in a filing with Bursa Malaysia yesterday.
