KUALA LUMPUR: Die-cutting solutions provider CEKD Bhd
has signed an underwriting agreement with M&A Securities Sdn Bhd ahead of its initial public offering on the ACE Market of Bursa Malaysia in September this year.
Under the agreement, M&A Securities will underwrite 19.46 million of the total proposed issue of shares allocated to the Malaysian public or through pink forms, it said in a statement.
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